The semiconductor industry has recognized the need to be able to accurately characterize the performance of semiconductor devices and various package systems and related components under a broad range of thermal environments.
Manufacturers of PCs and smaller scale devices have the requirement to quantify the cooling air requirements for individual boards, multi-board arrays and ancillary components.
We fabricate electronic cooling wind tunnels that are the accepted industry and research standard for electronic cooling flow test facilities. They feature:
More than 30 of these wind tunnels are in the laboratories of the world's leading semiconductor and computer manufacturers.
We also offer flow benches for testing that requires:
Our standard models provide:
Accessory ducts and heating components enable users to conduct thermal characterization tests of heat sinks and similar devices.