The semiconductor industry has recognized the need to be able to accurately characterize the performance of semiconductor devices and various package systems and related components under a broad range of thermal environments. Manufacturers of PCs and smaller scale devices must be able to quantify the cooling air requirements for individual boards, multi-board arrays and ancillary components.
We fabricate electronic cooling wind tunnels that feature:
ELD wind tunnels are the accepted industry and research standard for electronic cooling flow test facilities. More than 30 of these tunnels are in the laboratories of the world's leading semiconductor and computer manufacturers.
The prototype 12" Low Speed - Variable Temperature Recirculating Wind Tunnel was used to develop standard JEDEC 51-6, Integrated Circuit Thermal Test Method Environmental Conditions- Forced Convection (Moving Air).
We offer Flow Test Facilities for testing that requires the thermal characterization, pressure drop characteristics and flow performance of electronic components.